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The advance of SIC and GaN will once again be a topic at PCIM 2024 this year. Applications where these semiconductors are already being used in series products are exciting. Another focus at our stand is the LV100 (100x140mm) power package for IGBT and SiC half-bridge modules. Originally developed for railroad technology, it is becoming increasingly popular in industry and renewable energies. Adapted drivers such as the SCALE iFlex family from Power Integrations are now also available. This housing has the potential to replace many other modules in new developments.
At the trade fair, you will have the opportunity to meet the experts from HY-LINE as well as the manufacturers' FAEs and exchange information about new developments.
Among other things, we will be presenting at our stand
If you do not yet have tickets for PCIM 2024, we would like to invite you. You can have us send you a voucher which you can then redeem online. Please fill out the registration form below or send us an e-mail. Of course you can also contact us to arrange an appointment.
We look forward to your visit!