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PCIM 2024

11.06.2024 - 13.06.2024 | Messe Nuremberg, Hall 7/Booth 108

The advance of SIC and GaN will once again be a topic at PCIM 2024. Applications where these semiconductors are already being used in series products are exciting. Another topic is the 100x140mm power package for IGBT and SiC half-bridge modules. Originally developed for railroad technology, this package is offered by several semiconductor manufacturers - e.g. LV100 (Mitsubishi). It is becoming increasingly popular in industry and renewable energies. It is exciting to see which voltage and current classes are offered in this housing. Adapted drivers such as the SCALE iFlex family from Power Integrations are also now available. This housing has the potential to replace many other modules in new developments.

At our booth we present among others

  • IGBT, IPM, SiC, MOSFET and rectifier modules as well as suitable plug&play drivers, universal gate drivers as well as driver ICs and transformers
  • Wear-free high-performance film capacitors for intermediate circuits and supercapacitors in highest quality up to 3 V cell voltage as well as up to 3400 F capacity
  • AC/DC and DC/DC power supply modules of highest reliability from 0.25 to 3000 W
  • Converters for IGBT high-side supply 
  • Complete power supplies up to 150 kW, for medical applications up to 2 kW
  • Off-grid, stand-alone power supply with fuel cells
  • HY-Di®, the flexible battery system even for the most demanding applications
  • Galvanically isolated, bidirectional interface modules and data couplers with VDE certification, an insulation voltage up to 6 kV and over 8 mm creepage distance for highest data rates up to 150 MBit/s
  • Current transformers on inductive or Hall-effect basis as well as for measurement directly on the board with GMR technology


You are welcome to make an appointment with us at our stand. Please use the following form. But we also look forward to your visit without an appointment.

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