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Super Mini Full SiC DIPIPM

Dual-in-line Package Intelligent Power Modules with SiC-MOSFETs

Full SIC DIP is an ultra-small compact transfer molded intelligent power module integrating SiC MOSFET chip which is the next generation high efficiency power chips. Power chips, drive and protection circuits are integrated in the module with transfer molding resin.

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HY-LINE AG
+41 52 647 42 00
info@hy-line.ch
  • Integrated newly developed SiC MOSFET for improving efficiency
  • No requirement of negative bias by mounting MOSFET with high threshold voltage VGSth.
  • Single DC 18V power supply drive with bootstrappingscheme.
  • Safety operating SiC MOSFET by protection functions.
  • Easy to replace from conventional V.6 due to pin and function compatibility.

Mitsubishi Electric is the technology leader in the field of IGBT modules - now in their 7th generation - and Intelligent Power Modules (IPM). The compact design offers significant advantages, especially for harsh environmental conditions such as in drive technology.

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+41 52 647 42 00
info@hy-line.ch