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Tungsten700 SMARC

System-On-Module with MediaTek Genio

The new Tungsten700 is powered by MediaTek’s Genio 700 processor and the Sona MT320 Wi-Fi 6 / Bluetooth 5.3 radio based on MediaTek’s Filogic 320 (MT7921), high performance LPDDR4 RAM, and eMMC storage. It is combined this with an universal SMARC carrier board; together they serve as a single board computer (SBC) that can speed your product to market.

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • Chipset (MPU): 2x Cortex-A78 @ up to 2.2 GHz + 6x Cortex-A55 @ up to 2.0 GHz (MediaTek Genio 700)
  • Wireless Specification: Wi-Fi 6 (802.11ax) and Bluetooth 5.3
  • Dimensions (L x W): 82 x 50 mm
  • Additional Features: 2D Accelerator, 3.7 TOPS NPU
  • Interfaces - General
    • USB 3.0, USB 2.0, Gbit Ethernet, CAN/CAN-FD, UART, I2C, SPI, SDIO/eMMC, GPIO
    • MIPI-CSI, MIPI-DSI
    • Audio via I2S
  • Memory
    • 4 or 8 GB LPDDR4 RAM
    • 16 GB eMMC
  • Operating Temperature:
    • 0 to +70C
    • -40 to +85C (coming soon)
  • Region: FCC, IC, CE, UKCA, RCM, MIC, KC (pending)

Ezurio (fomerly Laird Connectivity) simplifies the adoption of wireless technologies with market-leading wireless modules and antennas, integrated sensor and gateway platforms, and custom wireless solutions.

Ezurio products are synonymous with high wireless performance and reliability. With world-class support and comprehensive product development services, Laird Connectivity reduces risk and shortens time-to-market for new developments and designs.

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Contact
+49 89 614 503 10
sales@hy-line.de