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MGM210P

Module for Bluetooth, Zigbee and Thread

MGM210 Bluetooth, Zigbee and Thread multi-protocol modules feature an optimized form-factor with either an integrated chip or PCB antenna in a low profile for space-constrained IoT designs including smart lighting, HVAC, building and factory automation systems. The module is offered in two form factors. The MGM210P designed in a traditional module form factor comes with chip antenna.

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • Supported Protocols:
    • Zigbee
    • Thread
    • Bluetooth 5.1
    • Bluetooth Mesh
    • Multiprotocol (Zigbee +Bluetooth 5.1)
  • Regulatory Certifications: FCC, CE, ISED
  • Operating Range & Size:
    • 1.8 V to 3.8 V, single supply
    • -40 °C to +125 °C
    • 12.9 mm × 15.0 mm × 2.2 mm
  • Wireless SoC:
    • 2.4 GHz Radio
    • Up to +20 dBm TX power
    • ARM Cortex -M33 MCU Core
    • 1024 kB Flash
    • 96 kB RAM
  • Current Consumption:
    • RX: 9.3 mA
    • TX (0 dBm): 16.1 mA
    • TX (12.5 dBm): 173 mA
    • EM2 (Deep Sleep): 5.1 μA
  • MCU Peripherals:
    • Up to 20 GPIO
    • 12-bit 1 Msps SAR ADC
    • 2 x Analog Comparator
    • Low Energy UART
    • 3 x USART (UART, SPI, IrDA, I2S)
    • 2 x I²C
    • Timers/Counters
    • 8-channel DMA Controller
    • 12-channel PRS

The manufacturer Silicon Labs from Austin / Texas, specialized in Bluetooth, Bluetooth Smart and Wifi technologies, offers an extensive family of various Bluetooth, Bluetooth Smart and Wifi modules for use in industry, medicine, telemetry, telematics, M2M and mobile systems.

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Contact
+49 89 614 503 10
sales@hy-line.de