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BGM210P

BT 5 high power

Based on the Wireless Gecko Series 2 SoC Silicon Labs presents the BGM210P Bluetooth PCB module. It offers unprecedented RF range and performance combined with a powerful MCU, 1MB flash memory, OTA firmware and core for demanding security applications. In addition, the BGM210P scores with a temperature range far above the industry standard.

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • Supported Protocols:
    • Bluetooth 5.1
    • Bluetooth Mesh
  • Regulatory Certifications:
    • FCC
    • CE
    • ISED
  • Operating Range & Size:
    • 1.8 V to 3.8 V, single supply
    • -40 °C to +125 °C
    • 12.9 mm × 15.0 mm × 2.2 mm
  • Wireless SoC:
    • 2.4 GHz Radio
    • Up to +20 dBm TX power
    • ARM Cortex -M33 MCU Core
    • 1024 kB Flash
    • 96 kB RAM
  • Current Consumption:
    • RX: 9.3 mA
    • TX (0 dBm): 16.1 mA
    • TX (12.5 dBm): 173 mA
    • EM2 (Deep Sleep): 5.1 μA
  • Security:
    • Secure Boot with Root of Trust and Secure Loader (RTSL)
    • Hardware Crypto Acceleration with DPA countermeasures
    • True Random Number Generator (TRNG)
    • ARM TrustZone
    • Secure Debug Interface lock/unlock
  • MCU Peripherals:
    • Up to 20 GPIO
    • 12-bit 1 Msps SAR ADC
    • 2 x Analog Comparator
    • Low Energy UART
    • 3 x USART (UART, SPI, IrDA, I2S)
    • 2 x I²C
    • Timers/Counters
    • 8-channel DMA Controller
    • 12-channel PRS

The manufacturer Silicon Labs from Austin / Texas, specialized in Bluetooth, Bluetooth Smart and Wifi technologies, offers an extensive family of various Bluetooth, Bluetooth Smart and Wifi modules for use in industry, medicine, telemetry, telematics, M2M and mobile systems.

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Contact
+49 89 614 503 10
sales@hy-line.de