Verbindet 5. Generation CSTB(TM) (Carrier Stored Trench Gate Bipolar Transistor) Chip Technologie mit einem LPT (Light Punch-through) Wafer.
Standard Halbbrücken-Gehäuse entspricht der gut eingeführten H-Serie
Sehr guter thermischer Übergang durch AlN Isolations-Substrat
Niedrige innere Induktivität
auch erhältlich als Mega Power Dual IGBT Modul 1200V (900 & 1400A) und 1700V (1000A) für Höchstleistungs UPS, Distributed Power Generation and General Pupose Inverters (Chopper modules on request)
Mitsubishi Electric is the technology leader in the field of IGBT modules - now in their 7th generation - and Intelligent Power Modules (IPM). The compact design offers significant advantages, especially for harsh environmental conditions such as in drive technology.
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