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3.5"-SBC-TGL

3.5" Single Board Computer with 11th Gen. Intel Core U-Series & Celeron 6000 Series processors

3.5"-SBC-TGL is a 3.5" single board computer powered by 11th Generation Intel® Core™ U-Series and Celeron® 6000 Series processors (codenamed Tiger Lake UP3) integrated with Intel's next-generation Iris® Xe Graphics. It delivers massive improvements in processing, graphics and AI performance, ideal for AI, deep learning and similar applications that demand high-speed processing, computer vision and low-latency deterministic computing.

The board supports up to two 8K video streams at 60 fps. Via the extended B2B connector, it can support four channels of DP signal outputs to drive four independent displays running 4K video at 60 fps.

In addition, the board supports configurable TDP done via BIOS settings, which provides flexibility to integrators to design a system according to the cooling techniques they use and the application scenarios they target.

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HY-LINE Technology GmbH
+49 89 614 503 10sales@hy-line.de
  • Processor:
    • Intel® Core™ i7-1185G7E / Intel® Core™ i7-1185GRE (Quad Core, 12M Cache, 1.8 / 4.4 GHz, FCBGA1449, 12 W ← 15 W → 28 W TDP)
    • Intel® Core™ i5-1145G7E / Intel® Core™ i7-1145GRE (Quad Core, 8M Cache, 1.5 / 4.1 GHz, FCBGA1449, 12 W ← 15 W → 28 W TDP)
    • Intel® Core™ i3-1115G4E (Dual Core, 6M Cache, 2.2 / 3.9 GHz, FCBGA1449, 12 W ← 15 W → 28 W TDP)
    • Intel® Celeron® 6305E (Dual Core, 4M Cache, 1.8 GHz, FCBGA1449, 15 W TDP)
  • Main Memory: 2x DDR4 3200 SO-DIMM up to 64 GByte
  • Graphics Controller:
    • Intel® Iris® Xe Graphics (Core™ i7 / i5)
    • Intel® UHD Graphics (Core™ i3 / Celeron®)
  • Display:
    • 1x LVDS (24-bit, 2-ch, 1920 x 1200 @ 60 Hz)
    • 2x DP (7680 x 4320 @ 60 Hz, on rear)
  • Audio Controller: TSI 92HD73C
  • Audio:
    • 2x Speaker-out (Right & Left, 3 W)
    • 1x Line-in (by header)
    • 1x Line-out (by header)
    • 1x Mic-in (by header)
  • Ethernet:
    • 1x 2.5 GbE LAN (RJ45 on rear, Intel® I225-LM/IT)
    • 1x GbE LAN (RJ45 on rear, Intel® I210-AT/IT)
  • USB:
    • 4x USB 3.2 Gen 2 (Type A on rear)
    • 4x USB 2.0 (by header)
  • Serial: 2x RS232/422/485 (by header)
  • Available I/Os: 8x DIO (by header)
  • SATA: 1x SATA 3.0
  • Expansion:
    • 1x M.2 Key B (Type 2242 / 3042 / 2280, w/ PCIe x1 / USB 2.0 / SATA 3.0)
    • 1x M.2 Key M (Type 2280, w/ PCIe x4)
    • 1x M.2 Key E (Type 2230, w/ PCIe x1 / USB 2.0, Intel® CNVi support)
    • 1x SIM Card Holder (Micro type, connected to M.2 Key B)
  • Input Voltage: DC 12 V
  • Power connector: 1x4-pin pitch 3.0 mm Wafer
  • BIOS: AMI uEFI BIOS w/ 256 Mb SPI Flash
  • Security : TPM 2.0 Support (Infineon SLB 9670)
  • Operating System: Windows 10, Linux
  • Operating Temperature
    • 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard)
    • -20 °C~ 70 °C / -4 °F ~ 158 °F (Extended)
    • -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extreme)
  • Compliance: CE Class B, FCC Class B

Kontron is a global leader in embedded computing technology and a sought-after consultant for the realization of business models and applications tailored to the Internet of Things. Thanks to its extensive portfolio of hardware, software and service solutions, Kontron achieves the optimum for the respective customer applications. This allows them to focus fully on their core competencies.

Kontron and its R&D staff are developing many of the standards that are driving the world of embedded computing platforms forward. These pioneering technologies and applications not only enable new business models, but also change and enrich the lives of millions of people. The result is faster time-to-market, lower total cost of ownership, long-term availability, and holistically optimized applications based on leading, highly reliable embedded technology.

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Contact
+49 89 614 503 10
sales@hy-line.de