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COMh-sdIL E2

COM-HPC®/Server with Intel® Xeon® D-1700 / D-1800 processor family

The COMh-sdIL with scalability from 4 to 10 cores, SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint. The module accommodates up to 64GB DDR4-ECC soldered memory, as storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

With 32x PCIe lanes (16x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdIL is an ideal platform for high data throughput requirements in demanding I/O and network structures.

  • Size D "small" form factor – 120 x 160 mm
  • Intel Xeon D-1700 / D-1800 Server platform
  • Up to 10 cores, processor TDP up to 67W
  • 16x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
  • 8x LAN Ports for various configurations - up to 100GbE
  • Memory: Max 64GB soldered memeory with ECC support
  • Optional onboard storage NVMe
  • Industrial temperature versions
  • Embedded management controller
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COM-HPC

Congatec is a leading provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COM). The powerful computer modules are used in a wide range of system applications and devices in industrial automation, medical technology, robotics, telecommunications, and many other industries. Congatec was founded in 2004 and is headquartered in Deggendorf.

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