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COMh-sdID (E2)
COM-HPC®/Server with Intel® Xeon® D-2700 / D-2800 processor family
The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24x7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint. The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.
With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.
- Size D form factor – 160 x 160 mm
- Intel Xeon D-2700 / D-2800 Server platform
- Up to 20 cores, processor TDP up to 125W
- 32x PCIe Gen 4.0 lanes + 16x PCIe Gen 3.0 lanes
- 8x LAN Ports for various configurations - up to 100GbE
- Memory: Max 512GB DDR4-DIMM with 4x DIMM sockets
- Optional onboard storage NVMe
- Industrial temperature versions
- Embedded management controller
JUMPtec specializes in the development of standard and highly customized computer products. Jumptec is the inventor of Computer-on-Modules and, as part of a global technology group, has been setting industry standards for decades. They started out with DIMM-PC® and ETX®, which evolved into COM Express® and COM HPC®. Their modules drive IoT/embedded computing technology, Industry 4.0, and smart IoT solutions.
