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COMe-bTL6 (E2)
COM Express Basic Type 6 with 11th Gen. Intel® Core/Xeon processors
The COM Express® COMe bTL6-H (Tiger Lake-H) CPUs are featuring up to 8 cores and are specifically suited for demanding Edge workloads and high-end, high-bandwidth applications. Intel® Iris® XeGraphics supports up to four independent 4K displays or one 8K HDR display. AI-workloads in machine vision or medical applications reach new levels of performance with the GPU and Intel® Deep Learning Boost. Integrated TSN- and Intel® TCC-functionality enable deterministic networks in Industry 4.0 as well as various real-time applications.
The TDP of the processor chips ranges from 25 to 45 watts, with eight processing cores enabling clock frequencies of up to 5.0 GHz. A maximum of three DDR4 SO-DIMM sockets allow a memory expansion of up to 96 GBytes (non-ECC/ECC). With integrated Intel® UHD graphics supporting up to four independent 4K displays, up to 40 HD video streams can be processed and analyzed in parallel at 1080p/30fps resolution. In addition, fast 2.5 GBit Ethernet with Time Sensitive Networking (TSN) and Intel® Time Coordinated Computing (Intel® TCC) predestines the module for demanding real-time applications.
As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally used, which enables highly effective data processing even under harsh conditions. The COMe-bTL6 (E2) module guarantees full computing power even in extreme industrial environments with temperatures ranging from -40 °C to +85 °C and offers a higher number of application-ready integrated features and more powerful cooling compared to alternative smaller form factor designs.
- Compliance: COM Express® basic, Pin-out Type 6
- Dimensions: 125 x 95 mm
- CPU: Intel® 11th Generation CoreTM / Xeon® family
- Chipset: HM570E, QM580E and RM590E
- Main Memory: 2x DDR4 SODIMM dual channel up to 64 GByte ECC or non ECC (optional 3rd SODIMM socket for 96 GByte)
- Graphics Controller: Intel® Iris®Xe Graphics on i7/i5 processors Intel® xxx Graphics on i3/Xeon® processors
- Ethernet Controller: Intel® I225LM/I225IT
- Ethernet: Up to 2.5Gb Ethernet with TSN & WOL support (depending on SKU)
- Storage: 4x SATA 6Gb/s
- Flash Onboard: Up to 1 TByte NVMe SSD (on request)
- PCI Express: 8x PCIe 3.0 (8GT/s), Default configuration 8x1, optional 1x4 + 4x1, 2x4 etc. 1x16 PCIe 4.0 on PEG Lanes #0-3
- Display: DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit
- USB: 4x USB 3.2; 8x USB 2.0
- Serial: 2x serial interface (RX/TX only)
- Audio: High Definition Audio interface
- Special Features:
- Trusted Platform Module TPM 2.0
- (G)SPI, LPC, SMB, Fast I2C, Staged Watchdog, RTC, support of Intel® OptaneTM memory technology via PCIe
- Power Management: ACPI 6.0
- Power Supply: 8.5 V – 20 V Wide Range, Single Supply Power
- BIOS: AMI UEFI
- Operating System: Windows® 10, Linux, VxWorks
- Temperature:
- Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
- Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
- Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
Congatec is a leading provider of high-performance hardware and software building blocks for embedded and edge computing solutions based on Computer-on-Modules (COM). The powerful computer modules are used in a wide range of system applications and devices in industrial automation, medical technology, robotics, telecommunications, and many other industries. Congatec was founded in 2004 and is headquartered in Deggendorf.
