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COMh-caRP
COM HPC/Client module size A with 13th Generation Intel® Core™ Processors
The COMh-caRP is based on 13th Gen Intel® Core™ processors (former codename Raptor Lake U/P/H. They offer a significant performance increase compared to the previous generation and are equipped with 14 cores up to 24 cores with Intel® performance hybrid architecture. The 13th generation is particularly well suited for connected IoT applications. A new embedded controller ensures improved availability, flexibility and system openness. The Module provides essential, industrial-grade features such as support for in-band error correction code (IBECC) memory, Intel® Time Coordinated Computing (Intel® TCC), Time-Sensitive Networking (TSN), and extended temp ranges of -40C to +85C Tjmax.
All features are perfect for high-performance computing in resource-intensive and demanding areas such as networking, automation and measurement and customers profit from longterm availability
- Up to 64 GByte DDR5 memory
- Up to 2.5Gb Ethernet with TSN support
- Optional NVMe SSD onboard
- Industrial grade
JUMPtec specializes in the development of standard and highly customized computer products. Jumptec is the inventor of Computer-on-Modules and, as part of a global technology group, has been setting industry standards for decades. They started out with DIMM-PC® and ETX®, which evolved into COM Express® and COM HPC®. Their modules drive IoT/embedded computing technology, Industry 4.0, and smart IoT solutions.
