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COMe-cEL6(E2)

COM Express Compact Type 6 with Intel Atom X6000E, Pentium and Celeron Series

The COMe-cEL6 COM Express compact Type 6 module is highly scalable and covers the entire range of Intel's x6000 IoT-ready embedded processors. The COMe-cEL6 portfolio range from a cost optimized dual-core Intel Celeron (2x 1.2 GHz with 6W TDP) iteration optimized for energy-sensitive applications to genuine quad-core Intel Atom (4x 1.9 with 12W TDP) versions for high-end real-time applications.

Users benefit from a significantly improved computing performance, an impressive performance-per-watt ratio and the long-term availability.

  • COM Express® compact, Pin-out Type 6
  • Dimension (H x W): 95 x 95 mm
  • CPU COMe-cEL6:
    • Intel® Celeron® J6413, 4C, 1.8/3.0GHz, 16EU, 10W
    • Intel® Pentium® J6426, 4C, 2.0/3.0GHz, 32EU, 10W
    • Intel® Celeron® N6211, 2C, 1.2/3.0GHz, 16EU, 6.5W
    • Intel® Pentium® N6415, 4C, 1.2/3.0GHz, 16EU, 6.5W
  • CPU COMe-cEL6 E2:
    • Intel® Atom® x6211E, 2C, 1.3/3.0GHz, 16EU, 6W
    • Intel® Atom® x6413E, 4C, 1.5/3.0GHz, 16EU, 9W
    • Intel® Atom® x6425E, 4C, 2.0/3.0GHz, 32EU, 12W
    • Intel® Atom® x6212RE, 2C, 1.2GHz/-, 16EU, 6W
    • Intel® Atom® x6414RE, 4C, 1.5GHz/-, 16EU, 9W
    • Intel® Atom® x6425RE, 4C, 1.8GHz/-, 32EU, 12W
  • Chipset: Integrated in SOC
  • Main Memory: Up to 32 GByte DDR4-3200 via 2x SODIMM sockets (In-Band ECC)
  • Graphics Controller: Intel® HD Gfx Gen11: 1x LVDS/eDP (3840 x 2160 @ 60 Hz) 2x DP (++) on DDI1/DDI2 up to 4K
  • Ethernet Controller: SOC + LAN PHY GPY115 (GPY215 on request)
  • Ethernet: 1GBit Ethernet (2.5GBit on request with GPY215)
  • Storage: 2x SATA 6Gb/s, SDIO Interface (shared with GPIO)
  • Flash Onboard: eMMC option – up to 128GB eMMC MLC
  • PCI Express: 6x PCIe Gen 3.0 lanes - PCIe lane configurations: 1 x4 /2 x2 / 4 x1 + 1 x2 / 2 x1
  • Display: DDI 1/2: DP++, LVDS: Dual Channel up to 48-bit or eDP on request
  • USB:
    • Default: 2x USB 3.1 (incl. USB 2.0) + 6x USB 2.0
    • Option: 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0
    • USB 2.0 port7 does support dual role (Client/Host)
  • Serial: 2x serial interface (RX/TX only)
  • Audio: Intel® High Definition Audio
  • Common Features: SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC
  • Special Features: Industrial grade temperature
  • Options: 
    • eMMC Flash configuration (up to 64 GByte pSLC, up to 128 GByte MLC)
    • eDP instead of LVDS
    • General Purpose SPI instead of Boot SPI
    • eSPI instead of LPC to the COMe connector
    • 4x USB3.1 w/ add USB-Hub instead of 2x USB 3.1
    • USB client, Trusted Platform Module TPM 2.0, de-populated LAN PHY
  • Power Management: ACPI 6.0
  • Power Supply: 8.5V - 20V Wide Range, Single Supply Power
  • BIOS: AMI Aptio V
  • Operating System: Windows® 10, Linux, VxWorks
  • Temperature:
    • COMe-cEL6 - commercial temperature: 0° C to +60° C operating, -30° C to +85° C non-operating
    • COMe-cEL6 E2 - industrial temperature: -40° C to +85° C operating, -40° C to +85° C non-operating
       
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COM Express

JUMPtec specializes in the development of standard and highly customized computer products. Jumptec is the inventor of Computer-on-Modules and, as part of a global technology group, has been setting industry standards for decades. They started out with DIMM-PC® and ETX®, which evolved into COM Express® and COM HPC®. Their modules drive IoT/embedded computing technology, Industry 4.0, and smart IoT solutions.

Product variants:

  • COMe-cEL6 E2 x6212RE: 
    • CPU x6212RE
    • SO-DIMM Inband-ECC
    • ETH PHY 1 GbE
    • 2x USB 3.1
    • LPC, LVDS
    • Op. Temp. -40 °C - 85 °C
  • COMe-cEL6 E2 x6414RE: 
    • CPU x6414RE
    • SO-DIMM Inband-ECC
    • ETH PHY 1 GbE
    • 2x USB 3.1
    • LPC, LVDS
    • Op. Temp. -40 °C - 85 °C
  • COMe-cEL6 E2 x6425RE: 
    • CPU x6425RE
    • SO-DIMM Inband-ECC
    • ETH PHY 1 GbE
    • 2x USB 3.1
    • LPC, LVDS
    • Op. Temp. -40 °C - 85 °C
  • COMe-cEL6 N6211: 
    • CPU N6211
    • SO-DIMM non-ECC
    • ETH PHY 1 GbE
    • 2x USB3.1
    • LPC, LVDS
    • Op. Temp. 0°C - 60°C
  • COMe-cEL6 J6426: 
    • CPU J6426
    • SO-DIMM non-ECC
    • ETH PHY 1 GbE
    • 2x USB 3.1
    • LPC, LVDS
    • Op. Temp. 0°C - 60°C
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