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COMe-bCL6

COM Express Basic Type 6 with 8th/9th Generation Intel Core/Xeon Processors

The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor.

Through the use of consistent COM Express connectors and feature implementation, the COMe-bCL6 is easily exchangeable and offers the most flexibility for customers designing it into their embedded devices based on individual carrier boards.

Especially the introduction of a hexa core CPU, memory expansion to possible 128GB, additional NVMe SSD onboard and the continuation of the Intel® Optane™ fast memory support for system acceleration shall be a differentiator to former applications.

Typical application areas can be found in markets such as communication, digital signage, professional gaming and entertainment, medical imaging and surveillance and security as well as industrial plant and machine line control on shop floor- and control room-level.

  • COM Express® basic, Pin-out Type 6
  • Dimensions (H x W x D): 125 x 95 mm
  • CPU
    • Intel® Xeon® 8th Gen E-2176M, 6x 2.7 GHz (4.4 GHz), GT2, 45/35 W
    • Intel® Core™ 8th Gen i7-8850H, 6x 2.6 GHz (4.3 GHz), GT2, 45/35 W
    • Intel® Core™ 8th Gen i5-8400H, 4x 2.5 GHz (4.2 GHz), GT2, 45/35 W
    • Intel® Core™ 8th Gen i3-8100H, 4x 3.0 GHz, GT2, 45/35 W
    • Intel® Xeon® 9th Gen E-2276ME (6x 2.8 GHz, GT2, 45W/35W)
    • Intel® Xeon® 9th Gen E-2276ML (6x 2.0 GHz, GT2, 25W)
    • Intel® Xeon® 9th Gen E-2254ME (4x 2.6 GHz, GT2, 45W/35W)
    • Intel® Xeon® 9th Gen E-2254ML (4x 1.7 GHz, GT2, 25W)
    • Intel® Core™ 9th Gen i7-9850HE (6x 2.7 GHz, GT2, 45W/35W)
    • Intel® Core™ 9th Gen i7-9850HL (6x 1.9 GHz, GT2, 25W)
    • Intel® Core™ 9th Gen i3-9100HL (4x 1.6 GHz, GT2, 25W)
    • Intel® Celeron® 9th Gen G4930E (2x2.4 GHz, GT2, 35W)
    • Intel® Celeron® 9th Gen G4932E (2x1.9 GHz, GT2, 25W)
  • Chipset: Intel® Mobile CM246 (Xeon®) / Intel® Mobile QM370 (Core™)
  • Memory: Up to 4x DDR4-2666 SO-DIMM with up to 128 GByte (non-ECC/ECC) (3rd/4th socket on request)
  • Graphics Controller
    • Intel® UHD Graphics P630 for Xeon® processor
    • Intel® UHD Graphics 630 for Core™ processors
    • Intel® UHD Graphics 610 for Celeron® processors
  • Ethernet
    • Intel® I219LM
    • 10/100/1000 MBit Ethernet
  • Hard Disk: 4x SATA 6Gb/s
  • Flash Onboard: Up to 1 TByte NVMe SSD (on request)
  • PCI Express / PCI support: 8x PCIe x1, 1x PEG x16
  • Panel signal: DDI1: DP++, DDI2: DP++, DDI3: DP++, VGA: -, LVDS: Dual Channel 18/24bit
  • USB: 4x USB 3.1 (incl. USB 2.0) + 4x USB 2.0
  • Serial: 2x serial interface (RX/TX only
  • Audio: Intel® High Definition Audio
  • Common Features: SPI, LPC, SMB, Fast I²C, Staged Watchdog, RTC, support of Intel® Optane™ memory technology via PCIe
  • BIOS: AMI Aptio V
  • Power Management: ACPI 6.0
  • Power Supply: 8.5 V – 20 V Wide Range, Single Supply Power
  • Operating System: Windows® 10, Linux, VxWorks
  • Temperature
    • Commercial temperature: 0 °C to +60 °C operating, -30 °C to +85 °C non-operating
    • Extended temperature: -25 °C to +75 °C operating, -30 °C to +85 °C non-operating
    • Industrial temperature: -40 °C to +85 °C operating, -40 °C to +85 °C non-operating
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COM Express

JUMPtec specializes in the development of standard and highly customized computer products. Jumptec is the inventor of Computer-on-Modules and, as part of a global technology group, has been setting industry standards for decades. They started out with DIMM-PC® and ETX®, which evolved into COM Express® and COM HPC®. Their modules drive IoT/embedded computing technology, Industry 4.0, and smart IoT solutions.

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